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Testiranje povezav v elektronskih vezjih

Testiranje povezav v elektronskih vezjih

The NIDays (National Instruments days) conference was held on October 22nd 2013 in Ljubljana.  At the conference, Mr. Martinjak from RC IKT presented a new method of detecting errors (bad link) on the printed circuit boards, which are exploiting measurements of small capacitance in the circuit. A prototype of the product received positive responses from the experts for SMD circuit boards manufacturing.

Modern, especially digital electronic circuits have very large digital connections where there are difficulties to identify causes and locations connected to bad circuits because of the specific production technology (BGA, QFN..). A new method for measuring small capacitance in the circuit allows integration of classic and automated methods of measurement of voltage – current characteristics of circuits and in this way greatly increases speed and precision of finding faults.  The results of the measurements are very precise and immune from the disturbance signals. RC IKT protected a new method of detection errors with a patent application.

slika-conference22. oktobra 2013 je v Ljubljani potekala konferenca NIDays (National Instruments Days). Na konferenci je g. Martinjak z RC IKT predstavil novo metodo odkrivanja napak (slabih povezav) na ploščah tiskanih vezij, ki izkorišča meritve malih kapacitivnosti v vezju. Prototip izdelka je bil deležen pozitivnih odzivov s strani poznavalcev izdelave SMD tiskanih vezij.

Sodobna, predvsem digitalna elektronska vezja imajo zelo veliko digitalnih povezav, kjer je zaradi tehnologije izdelave (BGA, QFN..) težko odkrivati vzroke in lokacije slabih povezan na tiskanini. Nova metoda merjenja malih kapacitivnosti v vezju omogoča integracije klasičnih in avtomatskih metod merjenja napetostno – tokovnih karakteristik vezja ter na ta način močno poveča hitrost in natančnost odkrivanja napak. Rezultati meritev so zelo natančni in imuni na motilne signale. RC IKT je novo metodo odkrivanja napak zaščitil s patentno vlogo.

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